[Read download] Silver Metallization: Stability and Reliability (Engineering Materials and Processes)
·•●- Daniel Adams, Terry L. Alford, James W. Mayer ·•●-
| #6284283 in Books | Springer London | 2007-12-10 | Original language:English | PDF # 1 | 9.21 x.38 x6.14l,.70 | File Name: 184800026X | 123 pages |
||||From the reviews:“This book is aimed at addressing and reviewing the engineering aspects of improving the thermal and electrical stability of silver with a view to use as an interconnect material in integrated circuits. … this book can provide a
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as...
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