(Read ebook) Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science)
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| #2341009 in Books | King Ning Tu | 2007-08-22 | Original language:English | PDF # 1 | 9.21 x.88 x6.14l,1.46 | File Name: 0387388907 | 370 pages | Solder Joint Technology Materials Properties and Reliability
||0 of 0 people found the following review helpful.| Very Good|By Jesse|Well written, easy to understand. Has great illustrations and explains the science of electro-migration clearly. I would recommend this book for anyone who wants to learn more about electro-migration.
The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing ...
[PDF.ej63] Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science) Rating: 4.86 (751 Votes)
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You easily download any file type for your device.Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science) | King-Ning Tu. A good, fresh read, highly recommended.
